Simulation-Integrated Design and Development of 3D-Printed Shape Memory Polymer-Based Dynamic Electromagnetic Interference Shields

MSCA (Marie Skłodowska-Curie)HORIZON-TMA-MSCA-PF-EFID: 101209099
EC Contribution
€2,162
Consortium Size
1 orgs
Start Year
2025
Summary

Electromagnetic interference (EMI) shielding is the mitigation of unwanted electromagnetic (EM) radiation, which hinders the smooth operation of electronic systems. Over time, EMI shielding research has advanced from static to smart shielding, where the shields dynamically respond to external stimuli (pressure, temperature, etc), providing real-time protection. However, existing research on smart/dynamic EMI shielding materials faces challenges in precision, sustainability, and integration, limiting their real-world applications. Current solutions often rely on porous petroleum-based materials such as polyurethane polymers, which lack microstructure control and require constant exposure to stimuli to maintain the ON/OFF state. Further, the high resource requirements and lack of pre-fabrication optimization in current research demand innovation. This proposal aims to address these challenges by leveraging simulation-integrated 3D printing techniques to design and develop various microlattice mesh structures based on sustainable polycaprolactone shape memory polymer integrated with conducting and magnetic nanoparticles for enhanced smart shielding ability. This pioneering and innovative approach of combining mechanical, thermal and EM simulation with 3D printing allows visualization, designing and meticulous analysis before fabrication, enabling real-time assessment of material responses under various stimuli and the creation of complex geometries with precision. In this proposal, a smart shield integrated prototype system for real world applications will be developed, addressing the crucial research gap associated with realizing device-integrable smart shields in a resource-efficient and sustainable manner. My experience in EM simulation-oriented investigations for developing rigid to flexible EMI shielding structures and substantial knowledge on microwave materials, that I gained during my PhD, will significantly aid in producing tangible outcomes from this proposal.

Consortium (1)